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Microspheres

Fmoc-Asp(t-Bu) Low Crosslinked Polystyrene-PEG S RAM Resin, 90 µm, Capacity 0.16-0.26 mmol/g

Catalog: TASK-28-5002422   CAS NO.: N/A
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Description

Fmoc-Asp(t-Bu) Low Crosslinked Polystyrene-PEG S RAM Resin (Fmoc-Asp(t-Bu) Low Crosslinked Polystyrene-PEG S Rink Amide Linker Resin) can be employed to create peptides that interact with antibody-binding sites, improving our understanding of antibody-antigen interactions and assisting in the development of antibody-based therapies. Aspartic acid is involved in the design of antibody fragments used in immunotherapy. Besides, aspartic acid residues are involved in many cell signaling pathways, especially in the context of receptor binding and signal transduction. This resin can be used to synthesize peptides that mimic or interact with receptor-ligand systems, particularly those involving G-protein coupled receptors (GPCRs) or enzyme-linked receptors. Polystyrene resin is an essential material for a wide range of uses in research, diagnostics, medical devices, and multiple industial applications from packaging to construction. Taskcm can provide polystyrene resins in kilograms. Please contact us if you are in need of this product.

Specifications

CAS NoN/A
Particle Size90 µm
Ship Within1-3 week
Storage Temp.room temperature
Shipping4-25℃ for up to 3 weeks
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