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Microspheres

Fmoc-Leu Low Crosslinked Polystyrene-PEG S RAM Resin, 90 µm, Capacity 0.16-0.26 mmol/g

Catalog: TASK-28-5002396   CAS NO.: N/A
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Description

Fmoc-Leu Low Crosslinked Polystyrene-PEG S RAM Resin (Fmoc-Leu Low Crosslinked Polystyrene-PEG S Rink Amide Linker Resin) combines several key components, including the Fmoc protection for the amino group, low crosslinked polystyrene for the resin backbone, a polyethylene glycol (PEG) linker for solubility, and an S RAM (Resin with Aminomethyl Linker) structure designed to improve synthesis efficiency. The resin is widely utilized in peptide synthesis applications where leucine plays an important role, such as in peptide drug development, peptide library generation, and peptide modifications. Polystyrene resin is an essential material for a wide range of uses in research, diagnostics, medical devices, and multiple industial applications from packaging to construction. Taskcm can provide polystyrene resins in kilograms. Please contact us if you are in need of this product.

Specifications

CAS NoN/A
Particle Size90 µm
Ship Within1-3 week
Storage Temp.room temperature
Shipping4-25℃ for up to 3 weeks
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